Ni-Comp 100^TM

Today is Sat, Jul 31 2010

HI-TEC PLATING Ni-Comp 100^TM

Nickel Teflon^® Plating

Ni-Comp 100^TM Is a composite electroless nickel plating process that deposits submicron particles of PTFE (polytetrafluoroethylene) commonly referred to as Teflon® throughout a hard electroless nickel matrix. The percentage of Teflon® in the plated deposit is typically 20-25% by volume and is uniformly dispersed as occluded particles within the coating.

Provides Many Advantages

Including but not limited to:

Self lubricating, very low coefficient of friction
Outstanding Release Properties
Excellent corrosion resistance
100% deposit uniformity, even on complex geometries
Ability to be plated on a wide range of substrates

Unique Properties Of Ni-Comp 100^TM

Reduce or Eliminate:

Sliding wear
Sticking and galling problems
Injection molding release problems
Non lubricated components

Ni-Comp 100TM

HI-TEC PLATING Ni-Comp 100TM

Nickel Teflon® Plating